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最近完成的NB thermal simulation

各位先進:
分享一個最近完成的NB模擬, 包括DDR, 3G Card, Wi-fi, CPU, MB, Heatpipe, Fan duct, Dual Inlet Blower, Battery module, Keyboard, Chassis. 建模, 計算速度及結果都還算滿意.

1. 模型外觀

  
下载 (9.98 KB)


2. 模型透視圖

  
下载 (37.12 KB)


3. 主要元件表面溫度及溫度截面圖

  
下载 (66.52 KB)



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大神点评15

散热 2011-5-1 09:42:28 显示全部楼层

It seems great! If you can share with us is much better.

动不动 2011-5-1 09:42:28 显示全部楼层



Have you simplified the model? How about you LCD display temp.?

凹凸曼 2011-5-1 09:42:28 显示全部楼层



If you need, I can share the material property and power consumption settings, but I can't share the full model with you. Sorry.

xlt 2011-5-1 09:42:28 显示全部楼层



1. I import the full model from 3D CAD file, and then setup the material and power consumption. Almost no simplification.
2. In this case, I didn't build the LCD panel. So, there is no LCD temperature result.

最凉 2011-5-1 09:42:29 显示全部楼层

can you share with us abou  mateial property,thanks !

阳光下 2011-5-1 09:42:29 显示全部楼层



The most important is thermal conductivity properties K (W/mK), the following are some example :
1. Chassis : 100 W/mK
2. Grease : 1.5 W/mK
3. Heatpipe : 4,000 W/mK
4. MB : Normal : 0.331 W/mK
            Planar : 36 W/mK
5. PAD : 2 W/mK
The material inside CPU and chipset are almost orthotropic or planar isotropic.

热热热 2011-5-1 09:42:29 显示全部楼层

处于好奇心,能模拟一下你这台电脑在夏天使用(35
花开茶蘼 2011-5-1 09:42:29 显示全部楼层



我猜測就是大約 35
AVC 2011-5-1 09:42:29 显示全部楼层

哦,是吗。呵呵

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