1. I import the full model from 3D CAD file, and then setup the material and power consumption. Almost no simplification.
2. In this case, I didn't build the LCD panel. So, there is no LCD temperature result.
The most important is thermal conductivity properties K (W/mK), the following are some example :
1. Chassis : 100 W/mK
2. Grease : 1.5 W/mK
3. Heatpipe : 4,000 W/mK
4. MB : Normal : 0.331 W/mK
Planar : 36 W/mK
5. PAD : 2 W/mK
The material inside CPU and chipset are almost orthotropic or planar isotropic.