用CFD开发和验证塑料方型扁平式封装的双电阻集约模型

用CFD开发和验证塑料方型扁平式封装的双电阻集约模型.pdf


2000 International Conference on High-Density Interconnect and Systems Packaging

Creation and Validation of a Two-Resistor Compact Model of A Plastic Quad
Flat Pack (PQFP) Using CFD
Weiran Xu, Sarang Shidore, and Paul Gauch6
Flomerics Inc.
2 Mount Royal Avenue, Suite 350
Marlborough, MA 01752

Abstract
A detailed thermal model of a package requires extensive computational resources to predict temperature distribution within the package accurately. Using the JEDEC two-resistor network model of the package will significantly alleviate this problem. This paper validates the two-resistor model of a Plastic Quad Flat Pack (PQFP) with a series of comparison studies between the detailed thermal model and the two-resistor compact model In all cases studied, the two-resistor model predicts the junction and case temperature remarkably well considering the simplicity of the model.
Keywords: Electronics Cooling, CFD, Compact Model, Two-Resistor Model, PQFP, Validation, and JEDEC