Ansys公司收购Ansoft公司后,将其下Siwave模块与IcePAK的数据打通,
用户可以在Siwave下 模拟 PCB板的信号完整性、电流、电压分布,然后
将电流经过Trace导致的焦耳热计算结果读入iCEPAK,实现电-热的耦合,
以此真实地仿真Pcb板的不均匀热耗分布、pcb真实的温度分布等等。
附件:Pcb板不均匀焦耳热耗的影响
Effect of Joule heat losses.pdf (909.34 KB)
SIwave and Icepak Integration(Study the effect of Joule Heating)
Objective
•To demonstrate the Benefits of SIwave and Icepak Integration for PCB Design
•The analysis will help the PCB design engineers to make much more informed decisions on the power integrity, such as
–Power dissipation
–Current constraints
–Thermal issues
Procedure
1.Do “DC IR Drop” analysis in SIwave
2.Transfer the Joule heating data from SIwave to Icepak
Modeling Details
•SIwave:
–Current Source and Sink at Package (SQFP28X28_208)U2: 2 Amp
–Voltage Source at VRM Location: 1 V
•Icepak
–Power dissipation on the components
–Velocity at Inlet :1 m/s
ProprietarySummary and Conclusion
•Significant temperature difference is observed between with and without trace heating on PCB
•Present study demonstrate a better way of PCB thermal analysis by including the trace heating effect
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