ANSYS Icepak R16.0 Update New Features and Enhancements
ANSYS Icepak R16.0 Update
• Multiphysics
– Icepak – HFSS/Maxwell/Q3D 2-way coupling
– Icepak – Ansoft 2-way coupling automation using Feedback Iterator
– Temperature-dependent power map import from Sentinel TI
• ECAD import
– EDB import capability
• Meshing enhancements
– Concurrent assembly meshing
• Modeling and GUI Enhancements
• Solver Enhancements – Parallel Speedup
– NC Interface creation – Surface monitoring • Post processing enhancements
Multiphysics
Two-way Coupling with HFSS/Maxwell/Q3D
• Import losses from HFSS/Maxwell/Q3D into Icepak
– Import volumetric and surface losses from HFSS/Maxwell/Q3D into Icepak via
the Workbench project schematic
– HFSS/Maxwell generate temperature-dependent data
• Export temperature feedback data from Icepak to HFSS/Maxwell/Q3D
– Icepak generates thermal feedback when solution cell updated • Perform coupling iterations until desired level of convergence – Manual cyclic updates of individual system components • Option to report assigned volumetric and surface losses in Icepak
Icepak ECAD Import Capabilities
• Cadence – Allegro 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– APD 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– SiP Digital/RF 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– Virtuoso 5.10, 6.14, 6.15, & 6.16 (Linux only) • Mentor Graphics
– Boardstation Classic 8.x (uses HKP design flow)
– Boardstation XE v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow)
– See ODB++ Below
• Zuken – CR5000 10 and higher (Zuken translator for .anf & .cmp)
– CR8000 2013 and higher (Zuken translator for .anf & .cmp)
• ODB++ – Altium Designer R10 and greater
– Cadence OrCAD 16.3 and greater
– Mentor Expedition EE7.9.1 and greater
– Mentor PADS 9.4 and greater
– Zuken Cadstar 12.1 and greater
• Other ECAD Formats
– .anf ANSYS neutral file format
– .dxf AutoCad drawing format
– .gds IC Chip format
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