JESD15 Thermal Modeling Overview

  
JESD15.pdf

Thermal Modeling Overview
JESD15
OCTOBER 2008

Introduction
In recent years, the role of thermal modeling in the thermal characterization of component packages has greatly increased in importance. Unlike thermal tests, in which the basic practices have achieved a certain level of maturity, thermal modeling methods and software are undergoing rapid advancement.

Hence this document and the associated series of documents are intended to promote the continued development of modeling methods, while providing a coherent framework for their use by defining a common vocabulary to discuss modeling, creating requirements for what information should be included in a thermal modeling report, and specifying modeling procedures, where appropriate, and validation methods.

This document provides an overview of the methodology necessary for performing meaningful thermal simulations for packages containing semiconductor devices. The actual methodology components are contained in separate detailed documents.

1 Scope
The modeling methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal simulation requirements. This document provides the OVERVIEW.

JESD15 Thermal Modeling Overview

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