Description
In this position, you will be mainly working and focusing on mechanical and/or structural retention design and/or reliability analysis for Chipset/VR/CPU thermal solution on Server product. You will be working closely with supplier to make sure thermal solution is compatible to High Volume manufacture and cost effectively.
Qualifications
You should possess a Bachelor or a Master of Mechanical design, a Master of Mechanics degree or relative engineering and/or equivalent. Additional qualifications include:
- Three years mechanical design experience in IT or relative industry, deep understanding of the HVM and cost effective of the design
- Good Experience on design based on manufacturing process: stamping, injection, die cast and others
- Knowledge of Thermal solution manufacturing process: such as AL extrusion; stacked-fin and folded fin and others
- Capability of controlling schedule and deliver job on time
- Good English communication both in written and/or oral is required; self learning and proactive
- Strong structural and/or reliability background and experience would be an added advantage
- Knowledge of Server product Arch* and chipset and/or VRs in Server boards would be an added advantage
- Additional knowledge of thermal would be an added advantage
属于内部推荐，有兴趣者可以把简历给我 wang.xi@intel.com. 请注明期望薪金。
简历直接写在email的正文里，不要粘贴附件。
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