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标准 IPC-A-600F Acceptability of Printed Boards

呵呵,哪位兄弟有时间啊?我现在想找个测试标准IPC-A-600F,在别的网站看到了,
但是公司现在只能从通过信任的网站上下载东西,我当时把咱们论坛报上去了,所以希望有时间的兄弟帮我下一下,

然后转到这个论坛来,我就可以下载了,谢谢热心的朋友了!


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小甜甜 2011-5-1 09:33:58 显示全部楼层

IPC-A-600F Acceptability of Printed Boards

IPC-A-600F.pdf

IPC-A-600F
Acceptability of Printed Boards

Developed by the IPC-A-600 Task Group (7-31a) of the Product Assurance Committee (7-30) of IPC

Acknowledgement  i
1.0 Introduction  1
1.1 Scope .. 1
1.2 Purpose  1
1.3 Approach To This Document . 1
1.4 Classification . 1
1.5 Acceptance Criteria .. 2
1.6 Reference  3
1.7 Dimensions And Tolerances .. 4
1.8 Terms And Definitions . 4
1.9 Workmanship . 4
2.0 Externally Observable Characteristics . 5
2.1 Board Edges .. 5
2.1.1 Burrs . 5
2.1.1.1 Nonmetallic Burrs  6
2.1.1.2 Metallic Burrs  7
2.1.2 Nicks . 8
2.1.3 Haloing . 9
2.2 Base Material .. 10
2.2.1 Weave Exposure  11
2.2.2 Weave Texture .. 12
2.2.3 Exposed/Disrupted Fibers  13
2.2.4 Pits and Voids  14
2.3 Base Material Subsurface .. 15
2.3.1 Measling .. 18
2.3.2 Crazing  19
2.3.3 Delamination/Blister  20
2.3.4 Foreign Inclusions  21
2.4 Solder Coatings and Fused Tin Lead . 22
2.4.1 Nonwetting . 22
2.4.2 Dewetting  23
2.5 Holes – Plated-Through – General .. 24
2.5.1 Nodules/ Burrs .. 24
2.5.2 Pink Ring . 25
2.5.3 Voids - Copper Plating .. 26
2.5.4 Plating Voids - Finished Coating  27
2.6 Holes – Unsupported . 28
2.6.1 Haloing  28
2.7 Printed Contacts .. 29
2.7.1 Surface Plating - General . 29
2.7.2 Burrs on Edge-Board Contacts  30
2.7.3 Adhesion of Overplate  31
2.8 Marking .. 32
2.8.1 General  33
2.8.2 Etched Marking . 34
2.8.3 Screened or Ink Stamped
Marking  35
2.9 Solder Resist (Solder Mask) . 36
2.9.1 Coverage Over Conductors  37
2.9.2 Registration to Holes (All Finishes)  38
2.9.3 Registration to Other Conductive
Patterns  39
2.9.3.1 Ball Grid Array (Solder Resist-
Defined Lands) .. 40
2.9.3.2 Ball Grid Array (Copper-Defined
Lands)  41
2.9.3.3 Ball Grid Array (Solder Dam) .. 42
2.9.4 Blisters/Delamination . 43
2.9.5 Adhesion (Flaking or Peeling) . 44
2.9.6 Skip Coverage  45
2.9.7 Waves/Wrinkles/Ripples  46
2.9.8 Tenting (Via Holes) .. 47
2.9.9 Soda Strawing  48
2.9.10 Thickness  49
2.10 Pattern Definition - Dimensional . 50
2.10.1 Conductor Width and Spacing . 50
2.10.1.1 Conductor Width  51
2.10.1.2 Conductor Spacing  52
2.10.2 External Annular Ring -
Measurement . 53
2.10.3 External Annular Ring - Supported
Holes .. 54
2.10.4 Annular Ring - Unsupported
Holes .. 55
2.11 Flatness . 56
3.0 Internally Observable Characteristics  57
海过来 2011-5-1 09:33:58 显示全部楼层

谢谢楼上,我看到好多地方有,但是公司现在的设定都不允许我下载,麻烦啊!再次谢谢版主!
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