Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages..

This paper presents fan swirl effects on cooling heat sinks and electronic packages. The case-to-air thermal
resistance, qca, of a power-dissipating device in a duct was compared with and without swirled airflow, for a
variety of heat sink configurations. For a given volumetric airflow rate through the duct, power dissipation,
and heat sink geometry, the presence of swirl always reduced qca. Enhanced cooling due to swirl was most
evident at low airflow rates and with crosscut heat sink geometries. Swirl effects were observed as far as 15
diameters downstream of the fan. Based on these results, to improve the accuracy of CFD models, the effects of
swirl should be taken into account in analysis of heat sinks and packages downstream of fans.

Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.pdf (109.47 KB)

this article is very useful!

文章內容真的很實用!!
重點都提到了

實驗的方法是為了要讓實驗模式讓自己將來建立CFD模型實有個比較有效率的建模方式；用風洞跟隧道方式來實驗風流比較穩定；所以我們可以多利用隧道方式來設計"風道"~~

感謝版主分享

谢谢版主！文章不错！

晕死了，扣了钱下不了