本帖最后由 ga021 于 2020-1-10 14:37 编辑
Thermal Design Engineer – CSPG
Location: Yishan Rd, Caohejing Hi-Tech Park, Shanghai
Opportunity Snapshot:
· The job involves working on thermal design and thermal testing in Cisco UnifiedComputing System. We are looking for candidates who excel in a fast pacedstart-up like environment.
· You will be part of a fast paced team, which with the foundations of opencommunications, empowerment, innovation, teamwork and customer success. Thus,you set your own limits for learning and achievements.
· You will be part of an experienced team working on a next generation datacenter and Visualization products. Work involves providing crucial feedback tohardware and software teams for improvements.
Responsibilities: · Cisco Unified Computing System peripheral (PCIe cards, CPU,Drive, DIMM etc) thermal solution simulation and thermal feature verification. · Do the thermal simulation based on thermal requirement input , andfigure out solution to optimize thermal performance of system or sub-system . · Test plan write up and testcases update. Testdata analysis and reports writing up. · Support design team and customer investigate issues and debug.
Requirements: Must have skill/experiences · Strong knowledge of mechanicaland thermal design. And can find the way to verify the design. · Strong lab hardware and thermal measurement tools andinstruments using experience and system debuggingskills. · 5+ years’ experience in themal design / thermal validation. Have theability to individually deliver thermal simulation and thermal validation result. · Familiar with thermal simulation software tools and mechanical designtool. · Well English speaking andwriting ability. Good at teamwork and communication across the teams. · Prefer to be familiar with x86system architecture, BMC subsystem, and fan speed control algorithm.
EducationalBackground: · Typically requiresMSEE/CS/Automation Control
Contact: Chris, please send your resume (English prefer) to leg@cisco.com |