Review of cooling Technologies for computer products

    author:Richard C. Chu, Robert E. Simons, Michael J. Ellsworth, Roger R. Schmidt, and Vincent Cozzolino

    Invited Paper

    Abstract—This paper provides a broad review of the cooling technologies for computer products from desktop computers to largeservers.For many years cooling technology has played a key role in enabling and facilitating the packaging and performance
    improvements in each new generation of computers. The role of internal and external thermal resistance in module level cooling is discussed in terms of heat removal from chips and module and examples are cited. The use of air-cooled heat sinks and
    liquid-cooled cold plates to improve module cooling is addressed. Immersion cooling as a scheme to accommodate high heat flux
    at the chip level is also discussed. Cooling at the system level is discussed in terms of air, hybrid, liquid, and refrigeration-cooled
    systems. The growing problem of data center thermal manage-ment is also considered. The paper concludes with a discussion of
    future challenges related to computer cooling technology.