JESD51-全集与大家分享

在JEDEC网站上下载的关于thermal design部分的标准，有需要的朋友可以看看。

论坛有相关JEDEC标准，点击下面标签即可查看

标准系列：
JESD51: Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

JESD51-1: Integrated Circuit Thermal Measurement  Method—Electrical Test Method (Single Semiconductor Device)

JESD51-2: Integrated Circuit Thermal Test Method Environmental Conditions—Natural Convection (Still Air)

JESD51-3: Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-4: Thermal Test Chip Guideline (Wire Bond Type Chip)

JESD51-5: Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

JESD51-6: Integrated Circuit Thermal Test Method Environmental Conditions—Forced Convection (Moving Air)

JESD51-7: High Effective Thermal Conductivity Test Board for  Leaded Surface Mount Packages

JESD51-8: Integrated Circuit Thermal Test Method Environmental  Conditions—Junction-to-Board

JESD51-9: Test Boards for Area Array Surface Mount Package Thermal Measurements

JESD51-10: Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements.

JESD51-11Test Boards for Through-Hole Area Array Leaded
JEDEC51-12: Guidelines for Reporting and Using Electronic Package Thermal Information.

哥们，这也太多了，下载太麻烦，建议传到一个免费的网络硬盘上，再把地址发上来，比如纳米盘

載來看看，謝謝共享。

好东西 谢谢分享

谢谢楼主,
分散了下载比较麻烦.

蒐集起來慢慢研究!!!感謝

谢谢楼主分享，大家共同进步。

hao dong xi a , xiexie la

感谢楼主分享，努力学习中

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