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Senior Engineer / Engineer, Thermal Design, ASTRI, HK



Deadline for Application: 2011-01-31

Description: The Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the HKSAR Government in 2000 with a mission of enhancing Hong Kong’s competitiveness in technology based industries through applied research. Owing to the continuous expansion in our R&D activities, we are seeking qualified professionals to fill the following position(s):

Job Duty:
.         Provide thermal design and analysis related support for development and implementation of microelectronics packages/modules, e.g. laminate or led-frame based IC packages, SiP modules, flip chip, MEMS and wafer-level packaging; and
.         Provide mechanical design supports, vendor survey, schedule control and testing/measurement.

Requirement:
.         Bachelor degree with 6+ years relevant experience, Master degree with 3+ years relevant experience in Mechanical, Materials or other related fields,
.         Skillful in using at least one of the following thermal design related software : ANSYS, ABAQUS, FloTherm;
.         Skillful in using AutoCAD, SolidWorks or other mechanical design software;
.         Experience in design and development of microelectronics packaging is a plus;
.         Excellent communication skills;
.         Strong team work spirit.
(Candidate with less experience or PhD fresh graduate will also be considered as Engineer)

Application: Appointment will be on renewable contract terms with a competitive salary and performance-linked variable pay. Fringe benefits include paid leave, medical and dental benefits, insurance coverage and contribution to MPF. The incumbent will normally work under a five-day week schedule.

Interested candidates should send application (quoting Ref. No.) with detailed resume and, current and expected salary to the HR Department by email (preferable), post or fax:

Email: hr-cv@astri.org
Post: 3/F, Bio-informatics Building, 2 Science Park West Avenue,
Hong Kong Science Park, Shatin, Hong Kong.
Fax: (852) 3641 1005

Only short-listed candidates will be notified. Personal data provided by applicants will be used for recruitment purposes only.


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大神点评6

少年梦 2011-5-1 09:35:34 显示全部楼层

工作地点在香港的话,好弄吗

AVC 2011-5-1 09:35:34 显示全部楼层



公司要你的话一般都没问题,会帮你办工作签证

forever 2011-5-1 09:35:34 显示全部楼层

请问在公司所在区域租房费(一室一厅),一般是多少呢?
公司是否提供公寓或者租房房源?
(对香港房租情况不太了解)

动不动 2011-5-1 09:35:34 显示全部楼层

似乎是很吸引人的,大家不要错过这个机会
房子应该不是问题,如果工资真的是很competitive


呵呵..關鍵是做得芯片封裝在香港是否會有機會?
如果那裏做不起來,那Thermal Design也就不樂觀了...
不是所有香港的機會都很好的..

在不疯狂 2011-5-1 09:35:35 显示全部楼层

恩,接触过这家公司,平心而论,待遇同香港的消费水平比起来,确实一般,而且国内的公司还有住房公积金,养老金什么的~~

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