Evaluation of a Liquid Cooling Concept for High Power Processors
Guoping Xu
Sun Microsystems, Inc.
9515 Towne Centre Drive, San Diego, CA 92121
Email: guoping.xu@sun.com
Abstract
A high performance liquid cooling architecture for high
power processors in less than 45 mm height electronics
chassis (1U rack space) was proposed and investigated
experimentally. A review of several system cooling
approaches from CPU to data center was also provided. The
present proposed method employs conventional heat pipes to
transport local CPU heat to the edge of an electronics module
coupled with system liquid cold plates. As coolant from
external cooling distribution unit in data center flows through
the system cold plates in the rack, CPU heat load is rejected to
data center cooling facility. Capable of removing the
processor power as high as 450W is demonstrated from a
prototype built. Experiments were conducted to characterize
the prototype thermal performance between liquid inlet and
heat pipe evaporator base. A 25 mm x 25 mm heat block was
used to simulate CPU and provide heat source to the heat pipe
evaporator base. The impacts of heat transfer rate, flow rate,
and liquid inlet temperature were evaluated. The total thermal
resistance of below 0.090 |
提升卡
置顶卡
沉默卡
喧嚣卡
变色卡
抢沙发
千斤顶
显身卡