JESD 22-A104C 加速热循环国际标准!

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JESD 22-A104c.pdf(118.53 KB)

JEDEC STANDARD
Temperature Cycling
JESD22-A104C
(Revision of JESD22-A104-B)
MAY 2005
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

TEST METHOD A104C
TEMPERATURE CYCLING
(From Board Ballot JCB-00-16, and JCB-05-82, formulated under the cognizance of the JC-14.1
Committee on Reliability Test methods for Packaged Devices.)
1 Scope
This specification applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing. In single chamber cycling, the load is placed in a stationary chamber, and is heated or cooled by introducing hot or cold air into the chamber. In dual chamber cycling, the load is placed on a moving platform that shuttles between stationary chambers maintained at fixed temperatures. In triple chamber temperature cycling there are
three chambers and the load is moved between them.
This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes.
Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
2 Terms and definitions
2.1 Load
The sample(s) and associated fixtures (trays, racks, etc.) in the chamber during the test.
2.2 Working zone
The volume in the chamber(s) in which the temperature of the load is controlled within the specified conditions.
2.3 Sample temperature: Ts
The temperature of the samples during temperature cycling, as measured by thermocouples, or equivalent temperature measurement apparatus, affixed to, or imbedded in, their bodies. The thermocouple, or equivalent temperature measurement apparatus, attachment method used should ensure that the entire mass of the sample(s) is reaching the temperature extremes and the soak requirements.

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