ANSYS ICEPAK13.0 已经发布，欢迎大家试用。

如题所示：http://www.ansys.com/products/icepak/features.asp#objIcepak Objects
ANSYS Icepak software contains many productivity enhancement features that enable quick creation and simulation of electronics cooling models of IC packages, printed circuit board and complete electronic systems.  Models are created by simply dragging and dropping icons of predefined objects – including cabinets, fans, packages, circuit boards, vents and heat sinks – to create models of complete electronic systems. These smart objects capture geometric information, material properties, meshing parameters, and boundary conditions – all of which can be parametric for performing sensitivity studies and optimizing designs.
ANSYS Icepak objects enable rapid model creation of electronics cooling models.
ECAD/MCAD Interfaces
To accelerate model development, ANSYS Icepak imports both electronic CAD (ECAD) and mechanical CAD (MCAD) data from a variety of sources. ANSYS Icepak directly supports IDF, MCM, BRD and TCB files that were created using EDA software such as Cadence Allegro or Cadence APD.  Additional products, AnsoftLinks and ANSYS Icegrb, enable ANSYS Icepak to import of ECAD data from a number EDA packages from Cadence®, Zuken®, Sigrity®, Synopsis® and Mentor Graphics®.
ANSYS Icepak directly supports the import of mechanical CAD data from neutral file formats including STEP and IGES files.  ANSYS DesignModeler software allows ANSYS Icepak to import geometry from all major mechanical CAD packages through the ANSYS Workbench geometry interfaces. Geometry imported from ECAD and MCAD also can be combined smart objects to efficiently create models of electronic assemblies.
Electric potential contours on a trace in a printed circuit board imported from ECAD data Flexible, Automatic Meshing
ANSYS Icepak contains advanced meshing algorithms to automatically generate high-quality meshes that represent the true shape of electronic components. Options include hex-dominant, unstructured hexahedral and Cartesian meshing, which enable automatic generation of body-fitted meshes with minimal user intervention. The mesh density can also be localized through non-conformal interfaces, which allow inclusion of a variety of component scales within the same electronics cooling model.  While fully automated, ANSYS Icepak also contains many mesh controls that allow customization of the meshing parameters to refine the mesh and optimize the trade-off between computational cost and solution accuracy. The meshing flexibility of ANSYS Icepak offers the fastest solution times possible without compromising accuracy.
Multi-level hex-dominant mesh ("hanging-node") on a sheet metal heat sink represented directly as mechanical CAD geometry.
Robust Numerical Solutions
ANSYS Icepak softare uses state-of-the-art technology available in the ANSYS FLUENT computational fluid dynamics (CFD) solver for the thermal and fluid-flow calculations. The ANSYS Icepak solver solves fluid flow and includes all modes of heat transfer – conduction, convection and radiation – for both steady-state and transient thermal-flow simulations. The solver uses a multi-grid scheme to accelerate solution convergence for conjugate heat transfer problems. The ANSYS Icepak solver provides complete mesh flexibility, and allows you to solve even the most complex electronic assemblies using unstructured meshes, providing robust and extremely fast solution times.
Thermal management simulation of a fan cooled rack mounted computer.

也太快了吧！！

热烈欢迎！

据我所知： 安世亚太的政策是这样的，如果你是正式客户，从购买软件起，一年之内是免费升级的。
否则，可能需要收取升级费用。

什麽時候Icepak集成Icepro就無敵了

icepak13.0的导入时不是比12.0的要好多了，能不能摆脱掉icepro啊！

STORM前几天刚说说，就发布了，这么快