JESD51-5 Extension of Thermal Test Board Standards

jesd51-5 Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms.pdf


Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JESD51-5
FEBRUARY 1999

1 Background
Previous JEDEC standards [1-2] and other test board standards residing under the thermal measurement
overview document [3] have described design specifications for construction of thermal test boards. These
specifications were intended for conventional leaded and leadless packages. They did not address packages
designed with the intention of direct thermal attachment to the test board such as deep downset packages or
thermally tabbed packages. This specification provides additional design detail for use in developing
thermal test boards with application to these package types. The design detail is in addition to and not in
replacement of the design specifications of those previous standards.