产品介绍 Product Introduction
导电点胶主要有导电填料和树脂等组成,这些树脂在固化后形成了导电胶的分子骨架结构,提供了力学性能和粘接性能保障,并使导电填料粒子形成通道,导电点胶可分为室温固化和高温固化体系,可采用点胶机连续作业。
Form in Place (FIP) Elastomers is mainly composed of conductive filler and resin. After curing, these resins form the molecular skeleton structure of conductive adhesive, provide the guarantee of mechanical properties and bonding properties, and form channels for conductive filler particles. Form in Place (FIP) Elastomers can be divided into room temperature curing and high temperature curing systems, which can be operated continuously by dispensing machine.
产品特点 Product Features
-就地成型,减少工艺成本 Form in Place, Reduce process costs
-多种导电材质可供选择 A variety of conductive materials are available
-低应力,高压缩 Low stress, high compression
典型应用 Typical Application
-光模块 Optical module
-服务器 Servers
-汽车电子 Automotive electronics
-医疗 Medical industry
-数据通信 DataCom
产品型号 Product Models
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