PTD&TAS Manual

ANSYS公司专业的芯片和PCB散热设计软件的用户手册，这两个软件可能用的人不多，是收购了哈佛大学一家热设计公司的产品，能够自动从ECAD软件中生成模型。

没用过。

请看ANSYS官方网站的说明
我也不知道ANSYS还有专门的散热软件，这是ANSYS官方网站的说明

Accurate thermal simulation of electronic components.

PTD brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.

Simulate all common packaging types -- leaded, leadless, BGA, Multi-chip packages, stacked die, system-in-package and multi-chip packages including traces, vias and wire bonds


Easy and intuitive user interface brings thermal analysis to designers without the need for a specialized background in heat transfer.


Perform trade studies to optimize the thermal design


The direct ECAD interface imports every die (even stacked die), trace, via, solderballs, encapsulant and bond wires.


Import complex geometry like lead frames or heat spreaders from MCAD tools.


Define non uniform power at the die level to predict hot spots.


Export the model to ANSYS for stress analysis


Put the component on a standard JEDEC board and simulate JEDEC thermal tests.


Fast solve time, typically minute

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Why Integrate Thermal Analysis Capabilities Into ECAD?


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"Today’s high-speed high pin count IC package designs demand that thermal analysis be part of the design cycle, and not just an isolated post design sign-off exercise.  Our customers have been asking for a proven well integrated and user friendly solution for IC Package thermal analysis, thanks to our Connections program that solution is now available."



Keith Felton, Group Director – Product Marketing for Cadence’s Allegro IC Packaging solutions


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"A number of our customers are encountering thermal related issues as a byproduct of the silicon densities of 130 and 90-nanometer design.  Compounding the problem is the growing popularity of stacked die packages that layer several die on one another in a single package.  Accurate thermal modeling of these scenarios is critical to successful design Synopsys customers now have the option to launch PTD 2.0 directly from our Encore design tool."


Kevin Rinebold, technical marketing manager for Synopsys


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Why include thermal simulation in your package design process?


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"We use PTD and find that it provides a turn-key solution for valuating package-level thermal designs using native ECAD data.  The ECAD interface makes PTD very easy to use and it dramatically reduces the time required to perform a detailed package level analysis. Equally important is that our benchmark validation exercises showed simulation accuracy to be within 10% of experimental data."

Jesse Galloway senior manager in charge of Thermal Characterization at Amkor Technology  
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"Before PTD was developed, we knew that the thermal performance of electronic packages is affected by the changes in the details of the design.  We didn't have the tools to thermally simulate them accurately so packages were treated as a black box.  Now with PTD we can open these black boxes and understand how the design changes, such as traces, vias, wirebonds, and solder masks, have an effect on their thermal performance.  PTD now allows Samsung to rapidly and more accurately access the thermal design of our packages."


Yunhyeok Im, Samsung, IPT Development, System LSI Division

ANSYS? TASPCB?
Designers are creating PC boards that are higher density, higher power and smaller than ever before. Do you have the thermal analysis tools necessary to keep up with these advances?




Realize and solve potential problems in the design phase and avoid costly over-design or failure in the field with TASPCB

TASPCB provides all the advanced thermal capabilities you need to:

Identify and solve thermal problems early in design – when failures are least costly to fix


Improve the overall thermal management of your PCBs for better reliability


Slash development time without risks of over-design or failure in the field


Increase overall product reliability and speed-up your time-to-market
TASPCB directly imports all the data from your ECAD tool including component data, traces, power and ground planes and vias to automatically create a three-dimensional board model. Put this together with a complete component database and CFD analysis of the air and you get unprecedented accuracy and speed.

icboy兄，PTD和TASPCB和哈佛大学任何关系，是Harvardthermal公司的产品，我在几年前评估过TASPCB。这个工具有其特点。