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封装常见材料参数

                                                        Elastic Properties of Metallic Elements Used In Electronic Packaging


MetalConditionE
(Elastic)
(GPa)G
(Shear)
(GPa)Tensile Strength
(MPa)Yield Strength*
(MPa)
Aluminum 99.996Annealed68.926.547.412.2
Antimony77.8 11
Copper 99.997Rod, cold-drawn127.7 46.8351340
Gold 99.99Cast74.4124
Lead 99.90Rolled, aged9.5 (0.5 %)
MolybdenumPressed, sintered sheet340690
Nickel >99.0Wrought, annealed210482138
Platinum 99.99Annealed147120-130
SilverStrained 5 %, heated 5 hr at 350 C71 – 78
TinPure, cast41 – 4521.4
Tin-5AgSheet, aged at room temp.31.724.8
Tungsten340 135
Zinc <0.10 PbHot-rolled strip134-160
     Material Properties of a Via-in-Pad Chip-Scale Package Printed Circuit Board Assembly Property
Material Young’s Modulus
(GPa)Poisson’s Ratio
(nu)Thermal Expansion Coefficient (alpha)
(10-6/K)
FR-4 epoxy-glass PCB substrate220.2818.5
Copper VIP
(via-in-pad)760.3517
Sn-37Pb
(eutectic) solderE=32.0-0.088.t (0 <= t <= 100, t is Celsius temp.)0.421
Underfill60.3530
Silicon chip1310.32.8
Solder mask6.90.3519
*Al 690.3322.8
*Si3Ni43140.333
Micro-via filler70.335
Bismaleimide
Triazene (BT)260.39
    Elastic Properties and Thermal Expansion Coefficient of Electronic  - Packaging Materials and Lead Solder Alloys MaterialTemp.
(&ordm;C)Young’s
Modulus,
(GPa)Poisson’sbr>Ratio (n )Thermal Exp.
Coefficient (10-6/K)
Sn-37Pb
(eutectic) solder-70
20
14038.1
30.2
19.70.4
0.4
0.424.0
24.0
24.0
Pb-10Sn -55
22
10013.4
9.78
4.910.4
0.4
0.427.8
28.9
30.5
Alumina
(substrate)-55
22
100303
303
3030.21
0.21
0.213.9
4.5
6.7
Silicon chip-73
27
127162
162
1620.22
0.22
0.221.40
2.62
3.23
Polyimide PWB-55 to
12514.50.1613.0
Hysol
FP4526
Underfill-73
25
52
77
102
1279.78
9.51
9.23
8.82
7.72
5.370.3
0.3
0.3
0.3
0.3
0.333.0
33.0
33.0
33.0
33.0
33.0



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大神点评6

Blossom 2011-5-1 08:52:35 显示全部楼层

这里包含封装中主要材料的参数,希望对于大家的研究有点帮助。

说不清 2011-5-1 08:52:36 显示全部楼层

这个很好,感谢hufeia的分享,大家有福了哈

你的美 2011-5-1 08:52:36 显示全部楼层

嗯,好材料。


赞的,数值模拟来说材料是最关键的第一步

夜光杯 2011-5-1 08:52:36 显示全部楼层

Thermal conductivity of some common materials as aluminum, asphalt, brass, copper, steel
补充以下

http://www.engineeringtoolbox.com/thermal-conductivity-d_429.html
全都是K值

冰雪男孩 2011-5-1 08:52:36 显示全部楼层

C:\Documents and Settings\Owner\Local Settings\Temporary Internet Files\Content.IE5\KX2N49Y3\smile[1].gif
谢谢搂主的无私分享!

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