ASTRI Career Opportunities: Senior Engineer, Thermal & Mechanical

Ref.# LL/SE/TM/100430 Senior Engineer, Thermal & Mechanical

Deadline of Application: 2010-05-10
Description:
The Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the HKSAR Government in 2000 with a mission of enhancing Hong Kong’s competitiveness in technology based industries through applied research. Owing to the continuous expansion in our R&D activities, we are seeking qualified professionals to fill the following position(s):

Job Duty:
?Technology & product development for thermal modules & systems in LED-SiP related applications;
?Responsible for LED-SiP related new material evaluation / testing for low-cost packaging solution;
?Work with product designer, R&D engineering group and customers to develop advanced LED-SiP related technologies and products; and
?Act as an application engineer for providing support to customers.  

Requirement:
?Master degree or above in Mechanical, Thermal Science, Physics or equivalent qualifications;
?5+ years working experiences in thermal & mechanical design;
?Familiar with CAD tools such as SolidWorks or others;
?Familiar with thermal simulation tools such as Flotherm, COSMOSWorks, or ANSYS or others;
?Solid experiences in leading a team in LED or advanced package technologies; and
?Good communication skill in English and Mandarin.

Application: Appointment will be on renewable contract terms with a competitive salary and performance-linked variable pay. Fringe benefits include paid leave, medical and dental benefits, insurance coverage and contribution to MPF. The incumbent will normally work under a five-day week schedule.

Interested candidates should send application (quoting Ref. No.) with detailed resume and, current and expected salary to the HR Department by email (preferable), post or fax:

Email:   hr-cv@astri.org
Post:    3/F, Bio-informatics Building, 2 Science Park West Avenue, Hong Kong Science Park, Shatin, Hong Kong.
Fax:      (852) 3641 1005

Only short-listed candidates will be notified. Personal data provided by applicants will be used for recruitment purposes only.