TIM应该是未来散热的焦点。拿出来给大家看一下
Thermal Interface Materials:Historical Perspective, Status,and Future Directions.pdf (1.22 MB)
Polymeric materials filled with heat-conducting particles can lower microelectronics operating temperatures by reducing the thermal resistance between chip surfaces and substrates.
By Ravi Prasher
ABSTRACT :With the continual increase in cooling demand for microprocessors, there has been an increased focus within the
microelectronics industry on developing thermal solutions.
Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution.
Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheology-based
modeling and design of polymeric TIMs due to their widespread use. Review of limited literature on the thermal performance of
solders is also provided. Merits and demerits of using nanoparticles and nanotubes for TIM applications are also
discussed. I conclude the paper with some directions for the future that I feel are relatively untouched and potentially very
beneficial.
KEYWORDS Bond line thickness (BLT); nanoparticles; nanotube;
polymer rheology; thermal boundary resistance; thermal
interface material (TIM)
NOMENCLATURE
Rcs Contact resistance between two bare solids
RcTIM Contact resistance of an ideal TIM
H Hardness
P Pressure
m Mean asperity slope |
提升卡
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抢沙发
千斤顶
显身卡