SEMI G30-88 TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE

悬赏金额: 30 金币
寻找这份Theta-Ja测试标准

PS:据说有钱能使鬼推磨
本来还想设定更高金额，结果最高只能到30，不是我抠门。。。。。。




改成一百,够用了吧,现在有钱人越来越多了

这年头，挣点钱不容易呀。

G030-0088.pdf (140.86 KB)

SEMI-G30-88

SEMI G30-88 TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES
1 Purpose
The purpose of this test is to determine the thermal resistance of ceramic packages using thermal test chips.

This test method deals only with junction-to-case or mounting surface measurements of thermal resistance and limits itself to heat sink and fluid bath testing environments. Following the guidelines outlined in this test method, junction-to-case thermal resistance measurements of ceramic packages using the heat sink and fluid bath methods should give the same results only under certain limited conditions (i.e., under conditions that approximate unidirectional heat flow through the chip and substrate to the preferred heat removal surface). If discrepancies occur, the heat sink mounting technique shall be considered as the referee test method. The heat sink mounting method for measuring junction-to-case thermal resistance will be a conservative measure of the package’s ability to transfer heat to the ambient environment because heatsinking is provided only on one side of the package,whereas the fluid bath mounting method has thepotential for equally cooling both sides of the package.

嘿嘿
所以超版你找得不对哦
哈哈哈我自己都觉得对不起了
哈哈哈哈
这个奖金你不能拿走了

怎么变成管理员把钱拿跑了

没关系的，
最近不少人发了财,原来都是去买金钱卡了,又进了一批

谢谢，找了很久了