Ansys Icepak 12.0 aids electronics heat management

Ansys Icepak 12.0 aids electronics heat management
An Ansys product story  Edited by the Manufacturingtalk editorial team Jul 6, 2009
Ansys has released its Ansys Icepak 12.0 software, which provides robust and powerful fluid dynamics technology for electronics thermal management.
This release introduces new solutions for printed circuit board (PCB) and package thermal analysis, new and enhanced technology for meshing complex geometry and new physical modelling capabilities.
These advances enable engineers that design electronic components for products such as cell phones, computers and graphics cards to improve design performance, reduce the need for physical prototypes and shorten time to market.
Ansys Icepak software accelerates the product development process by accurately simulating the dissipation of thermal energy in electronic devices at the component, board or system level.
Based on the Ansys Fluent CFD solver, Ansys Icepak software has a streamlined user interface that speaks the language of electronics design engineers, enabling the rapid creation of models of complex electronic assemblies.
Integration of Ansys Iceboard and Ansys Icechip capabilities into Ansys Icepak 12.0 provides engineers with an integrated platform to analyse package, PCB and system designs.
Direct import of electronic CAD (ECAD) designs allows engineers to model all components of packages and PCBs, including, traces, vias, solder balls, solder bumps, wire bonds and dies.
A new PCB trace Joule heating-modelling capability and the import of DC power-distribution profiles from Ansoft SIwave software enhance the accurate thermal simulation of PCBs.

我们公司已经装这个12版本了，就是划分直接导入擦模型的网格功能有所改进