热设计论坛

标题: EIA/JESD51-2 IC Thermal Test Method Environment [打印本页]

作者: KOKO 时间: 2011-5-1 09:42
标题: EIA/JESD51-2 IC Thermal Test Method Environment
EIA_JESD51-2.pdf

Integrated Circuits Thermal Test Method Environment Conditions -Natural Convection (Still Air)

Contents
Page
1 Introduction 1
1.1 Purpose 1
1.2 Scope 1
1.3 Rationale 1
1.4 References 2
1.5 Definitions 2
2 Environmental conditions for natural convection measurements 2
2.1 Test enclosure assembly 2
2.2 Test fixture support 4
2.3 Edge connector 5
2.4 Thermocouple 5
2.5 Test board 5
2.6 Material 5
3 Thermal measurement procedure and methodology 6
3.1 Device mounting 7
3.2 K factor calibration 7
3.3 Test start-up and initial equilibrium verification 7
3.4 Power level selection and applying power 7
3.5 Verification of thermal steady-state and test completion 8
4 Thermal characterization parameter - YJT junction -to-top center of package
(optional procedure)
8
4.1 Thermocouple placement location 8
4.2 Package thermocouple application 9
4.3 Procedure 9
5 Test conditions to be reported 10
Annex A 11

作者: Edelweiss 时间: 2011-5-1 09:42

好标准，谢谢

作者: 哈哈哈哈 时间: 2011-5-1 09:42

请问这个方法是如何来的

作者: huayuan008 时间: 2020-6-2 16:17
好标准，谢谢

欢迎光临热设计论坛 (https://resheji.com/bbs/)