? Responsible for board and system level thermal design, simulation analysis for variable product such as
Storage/server, router, telecommunication, LED lighting, etc.
? Develop and design leading edge cooling systems for high end processor and system applications
? Support Electrical Engineering group for PCB design layouts.
? Interface with a multi-disciplinary group to define system requirements, and design products. Experience in working in medium sized multidisciplinary development teams.
? Interface with heat sink and air mover vendors to keep up to manage cost, quality and functionality.
? Support Manufacturing Engineering and System Builders for System level debug and root cause analysis
? Work with function team to identify route cause of system failure
? Implement thermal solutions that meet product specifications, and cooperate with firmware to make fan speed control strategy.
? Provide thermal modelling from chip to system level, through CFD tools.
? Document thermal test plan and Perform thermal, air flow/impedance, acoustic measurements.
Requirement
Candidates should have 2 more years' experience in thermal design, possibly well versed in server, router designs. Candidates should have the following essential qualifications and experience:
? BSME or above in Thermal and Flow Engineering
? Knowledge about Mechanical design tool such as Pro/E considered as a plus
? Strong user of Flotherm CFD analysis tools, FloEFD is a plus.
? Knowledge of electrical and electronics system and the system safety issues.
? Agency compliance: familiarity with NEBS, GR-63, ETSI300,etc
? Familiar with thermal test tool such as temperature data logger, IR camera, air chamber, etc.
? Language ability: spoken and written English
location: shanghai pudong
company: canada based
pls send CV to : bertfanyy@yahoo.com.cn