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标题: EIA/JESD51 Methodology for the Thermal Measurement [打印本页]

作者: 冰雪男孩 时间: 2011-5-1 09:35
标题: EIA/JESD51 Methodology for the Thermal Measurement
jesd51 Methodology for the Thermal Measurement of Component Packages (Single Semiconductor).pdf

EIA/JESD51 Methodology for the Thermal Measurement

JESD51-全集与大家分享

作者: fluent 时间: 2011-5-1 09:35
标题: EIA/JESD51
好资料，谢谢楼主分享。

作者: delta 时间: 2011-5-1 09:35

Characterizing the Thermal Solution Requirement
The idea of a “thermal characterization parameter”

作者: 你的美 时间: 2011-5-1 09:35

Key: This can be a useful value for verifying device temperatures in an actual environment.

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