Description: The Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the HKSAR Government in 2000 with a mission of enhancing Hong Kong’s competitiveness in technology based industries through applied research. Owing to the continuous expansion in our R&D activities, we are seeking qualified professionals to fill the following position(s):
Job Duty:
. Provide thermal design and analysis related support for development and implementation of microelectronics packages/modules, e.g. laminate or led-frame based IC packages, SiP modules, flip chip, MEMS and wafer-level packaging; and
. Provide mechanical design supports, vendor survey, schedule control and testing/measurement.
Requirement:
. Bachelor degree with 6+ years relevant experience, Master degree with 3+ years relevant experience in Mechanical, Materials or other related fields,
. Skillful in using at least one of the following thermal design related software : ANSYS, ABAQUS, FloTherm;
. Skillful in using AutoCAD, SolidWorks or other mechanical design software;
. Experience in design and development of microelectronics packaging is a plus;
. Excellent communication skills;
. Strong team work spirit.
(Candidate with less experience or PhD fresh graduate will also be considered as Engineer)
Application: Appointment will be on renewable contract terms with a competitive salary and performance-linked variable pay. Fringe benefits include paid leave, medical and dental benefits, insurance coverage and contribution to MPF. The incumbent will normally work under a five-day week schedule.
Interested candidates should send application (quoting Ref. No.) with detailed resume and, current and expected salary to the HR Department by email (preferable), post or fax:
Email: hr-cv@astri.org
Post: 3/F, Bio-informatics Building, 2 Science Park West Avenue,
Hong Kong Science Park, Shatin, Hong Kong.
Fax: (852) 3641 1005
Only short-listed candidates will be notified. Personal data provided by applicants will be used for recruitment purposes only.
