Integrated Circuit Thermal Test Method Environmental Conditions -Forced Convection (Moving Air)
JESD51-6
MARCH 1999
Contents
1 Scope 1
2 Normative references 1
3 Definitions, symbols, and abbreviations 1
4 Specification of environmental conditions 2
4.1 Wind tunnel specifications 2
4.1.1 Flow uniformity 2
4.1.2 Swirl 2
4.1.3 Turbulence 3
4.1.4 Unsteadiness 3
4.1.5 Chamber size 3
4.1.6 Temperature uniformity 4
4.1.7 Performance verification 4
4.2 Test board 4
4.3 Placement in the test section 4
4.3.1 Orientation 6
4.3.2 Measurement 6
4.3.3 Simultaneous testing 6
4.4 Test fixture support 7
4.5 Environmental conditions and measurements 7
4.5.1 Flow velocity measurement 7
4.5.2 Ambient temperature measurement 7
5 Thermal measurement procedure and methodology 8
5.1 K factor calibration 9
5.2 Test start-up and initial equilibrium verification 9
5.3 Power level selection and applying power 10
5.4 Verification of thermal steady-state and test completion 10
5.5 Verification of absence of interaction between applied power level and temperaturesensitive parameter (optional procedure)
6 Thermal characterization parameters 11
6.1 YJT Junction-to-top-center of the package (Optional procedure) 11
6.2 YJT Junction-to-board (Optional procedure) 11
7 Test conditions to be reported 12
Figures
1 Open circuit wind tunnel 2
2 minimum clearance 3
3 Test section 4
4 Horizontal air flow, horizontal board (Package up) 5
5 Horizontal air flow, vertical board orientation 5
6 Vertical air flow, vertical board 6
7 Thermocouple location 11
Tables
1 Recommended power levels 10
2 Thermal measurement test conditions and data parameters 12
1 Scope
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard test board.
The thermal resistance measured using this document is RqJMA or qJMA. This methodology is not meant to and will not predict the performance of a device in an application-specific environment.