标题: Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.. [打印本页] 作者: 千里目 时间: 2011-5-1 09:29 标题: Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.. This paper presents fan swirl effects on cooling heat sinks and electronic packages. The case-to-air thermal
resistance, qca, of a power-dissipating device in a duct was compared with and without swirled airflow, for a
variety of heat sink configurations. For a given volumetric airflow rate through the duct, power dissipation,
and heat sink geometry, the presence of swirl always reduced qca. Enhanced cooling due to swirl was most
evident at low airflow rates and with crosscut heat sink geometries. Swirl effects were observed as far as 15
diameters downstream of the fan. Based on these results, to improve the accuracy of CFD models, the effects of
swirl should be taken into account in analysis of heat sinks and packages downstream of fans.
Fan Swirl Effects on Cooling Heat Sinks and Electronic Packages.pdf (109.47 KB)
