标题: JESD总结介绍.(Thermal Characterization of Packaged) [打印本页] 作者: 龙城 时间: 2011-5-1 09:22 标题: JESD总结介绍.(Thermal Characterization of Packaged) 忘记了。。。。
介绍各个散热参数的，对JESD有点总结的一份文章，看起来比较容易
Introduction
With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device performance can come at a price - higher temperatures and lower reliability - if thermal considerations aren't carefully weighed.
Not only are devices trending smaller but the boards they mount onto are also shrinking. Placing the units closer and closer together on smaller boards helps lower overall system size and cost, and improves electrical performance. These benefits are important; but from a thermal standpoint, raising power while reducing size is a bad combination. It's this increase in "power density" that's been driving the heightened industry focus on thermal management.
The Concept of Thermal Resistance
A common method of characterizing a packaged device's thermal performance is with "Thermal Resistance", denoted by the Greek letter "theta" or θ. For a semiconductor device, thermal resistance indicates the steady state temperature rise of the die junction above a given reference for each watt of power (heat) dissipated at the die surface. Its units are deg C/W.作者: 6sigmaET 时间: 2011-5-1 09:22
