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标题: Package Study [打印本页]

作者: 哈哈哈哈 时间: 2011-5-1 09:17
标题: Package Study
Typical Package Level Application

This package-level model shows a quarter of the package with
Object-based model setup and automated meshing are used for fast problem definition. The computational mesh includes 38,000 cells, and uses unstructured meshing to minimize the overall cell count, while clustering the grid for best accuracy. Icepak's material database makes property specification easy and its ability to model anisotropic or temperature-dependent conductivity contribute to accuracy.
The analysis consists of conduction heat transfer through the package, with the package exposed to convective boundary conditions, as follows:
Alternate heat transfer boundary conditions that might be used include specified temperature, specified heat flux, or specified radiation conditions. The solution to the conduction problem is obtained in 10 CPU seconds, for the mesh considered here.
The Icepak results indicate temperature distribution on the chip, copper base plate, the lead frame, and the leads. For clarity, the temperature distribution in the plastic is not shown here. The maximum temperature predicted is 28 C.
Additional analyses can be performed after varying the different design parameters.

作者: Nidec 时间: 2011-5-1 09:17

怎么只有开头

作者: ADDA 时间: 2011-5-1 09:17

最近也在做个lead frame的package，那个lead frame拐来拐去的，要比这个复杂得多，并且要算convection。现在mesh quality不太好，不过收敛应该问题不大。
我的问题是，这个package里最细的那几条是wire bond吗？个人觉得这个在传热上的作用不会很大，是否可以省去？不知有没有人做过这方面的比较？

作者: AVC 时间: 2011-5-1 09:17

那个lead frame 确实挺烦人，至于金线一般就省了

作者: 冰雪男孩 时间: 2011-5-1 09:17

Leadframe其实也可以简化一下，误差不是很大。

作者: Magic 时间: 2011-5-1 09:17

我一般也就是简化一下倒角什么之类的，大致的布局还是不改

作者: guxt86 时间: 2013-2-19 12:08

Magic 发表于 2011-5-1 09:17
我一般也就是简化一下倒角什么之类的，大致的布局还是不改