标题: 海拔对温升的影响PREDICTION OF ELECTRONIC COMPONENT TEMPERATURES AT HIGH [打印本页] 作者: 凹凸曼 时间: 2011-5-1 09:16 标题: 海拔对温升的影响PREDICTION OF ELECTRONIC COMPONENT TEMPERATURES AT HIGH <prediction of electronic component temperature at high altitude using low altitude measurems> from IBM company engineer. wish to some help to you all.
David A. Hall
IBM Corporation
11400 Burnet Road Dept. 515 / Bldg. 045 Austin. Texas 18758
ABSTRACT
Analytical prediction of developing flow,forced air-cooled electronic component temperatures at high altitudes using near sea-level temperature measurements is compared with experiments performed at 198 meters (650 ft.) and 1646 meters (5400 ft.) above sea level. The correlation
Nu = 0.501(Re) 0.68
is derived from experimental data. The derived correlation does not agree with literature correlations developed for fully developed laminar or turbulent two-dimensional flow over a constant temperature flat plate, but predictions fall within +3.6% and -1.1% of measured temperatures. Altitude correction factors for ambient air preheat and module thermal resistances measured at 198 meters are determined for 915 meters (3000 ft.), 1646 meters (5400 ft.), and 2135 meters (7000 ft.). An example of temperature prediction for 2135 meters based on measurements made at 198 meters is presented.
