Latest Res earch Advancement and Assessment of Chip Cooling Techniques
Li Tena and Liu Jing (Technical Institute of Physics and Chemistry，Chinese Academy of Sciences，Beijing 100080)
Abstract Improvement on the chip integration density has to face the restriction fr(>m the thermal barrier caused by the heat generation within the electronic elements．Recently，with the rapid progress of the micro／nano electronics，requirement on high perform ance chip cooling techniques has been further placed at a new high leve1．Eforts made towards this direction have led to the establishment of a series of new exciting methods．Based on anatyzing the heat ge neration mechanisms of the electronic elements，the newly emerging chip cooling tec hniques and their practical applications are reviewed ．Advantages and shortcomings of these methods and the relative critical issues are evaluated ．Prospect in the chip cooling area is also stated ．
Keywords Pyrology；chip cooling technique；review；chip package；enhanced heat transfer；gas cooling；liquid cooling；so lid refrigeration
l 芯片发展趋势对冷却性能的要求
微电子芯片的应用遍及日常生活、生产乃至国家安全的各个层面，在现代文明中扮演着极其重要的角色。芯片发展的趋势是进一步提高集成度、减小芯片尺寸及增大时钟频率，这由图1反映的几种具有革命意义的集成电路的发展沿革中即可略见一斑。1971年Intel公司生产的第一个芯片只含2300个晶体管，而如今在一枚Intel奔腾4芯片上，就集成有4200万个晶体管。根据著名的“摩尔定律”推算：芯片上的晶体管每18个月翻一番，那么到2010年，芯片上晶体管的数量将超过10亿。高集成度对于计算机性能的升级是有利的。然而，由此带来的问题是，芯片耗能和散热问题也凸现出来。与晶体管集成度迅速提高趋势相伴随的是，芯片功率与功率密度也急剧增加：与摩尔定律类似，CPU芯片的功率每36个月翻一番?。图2反映了Intel公司生产的芯片设计功率随时间增长的情况。作者: 阳光下 时间: 2011-5-1 09:14