Fluid Coolers
Power dissipations of many kW possible
Effective cooling of power semiconductors can be achieved using Curamik DBC fluid coolers, due to the direct contact between bare power die and the cooling baseplate, thus minimizing the thermal resistance between the power semiconductors (i. e. IGBT, Diodes, LED) and the cooling fluid.
The main feature of the DBC coolers is a micro channel structure of thin copper layers, which are attached hermetically to each other during the Curamik bonding process, without using any solder, gluing or brazing technology.
The greatly increased copper surface area makes effective cooling possible. The specific micro channel structure determines the thermal resistance, the pressure drop and the flow rate characteristics of the cooler. The inlet and outlet of the cooling fluid are located on the rear of the cooler and are sealed with press fits by O-ring seals or threaded fittings.
Following variations are available:
?? Electrically insulated DBC coolers with AlN DBC on both sides for high power applications
?? Electrically insulated DBC coolers with Al2O3 DBC on both sides for standard applications
Non-isolated copper coolers provide a low priced variation (with power dies assembled on individual DBC substrates will be soldered onto the cooler)
The insulating coolers may be configured with vias or insulated leads (front- and backside DBC through the cooler structure). Different surface plating or machining is also available.
