电子产品的散热设计
Heat-dissipating Design of Electronic Products
卢申林 (ReliaSoft (中国)有限公司技术中心,哈尔滨,150080)
摘 要: 随着电子产品的复杂性提高,产品的发热也随之上升。对于现在的产品设计而言散热已经成为一个挑战,这是每个设计人员都必须面对的问题。本文就热设计做以介绍。
关键词: 热设计、风扇、噪音、温度测量
中图分类号: TN306 文献标识码: B 文章编号: 1003-0107(2004)11-0046-03
Abstract: With the Electronic product power increase, the product surface temperature also increase. It have became a challenge for the designer, all of them must face it. This subject will introduce the thermal design.
Key words: Thermal design, FAN, acoustic, temperature measure
CLC number: TN306 Document code: B Article ID: 1003-0107(2004)11-0046-03