标题: Review of cooling Technologies for computer products [打印本页] 作者: 123 时间: 2011-3-7 23:54 标题: Review of cooling Technologies for computer products author:Richard C. Chu, Robert E. Simons, Michael J. Ellsworth, Roger R. Schmidt, and Vincent Cozzolino
Invited Paper
Abstract—This paper provides a broad review of the cooling technologies for computer products from desktop computers to largeservers.For many years cooling technology has played a key role in enabling and facilitating the packaging and performance
improvements in each new generation of computers. The role of internal and external thermal resistance in module level cooling is discussed in terms of heat removal from chips and module and examples are cited. The use of air-cooled heat sinks and
liquid-cooled cold plates to improve module cooling is addressed. Immersion cooling as a scheme to accommodate high heat flux
at the chip level is also discussed. Cooling at the system level is discussed in terms of air, hybrid, liquid, and refrigeration-cooled
systems. The growing problem of data center thermal manage-ment is also considered. The paper concludes with a discussion of
future challenges related to computer cooling technology.