封装外壳散热技术及其应用
龙 乐（成都龙泉天生路205 号1 栋208 室，成都 610100）
摘 要：微电子器件的封装密度不断增长，导致其功率密度也相应提高，单位体积发热量也有所增加。为此，文章综述了封装外壳散热技术的基本原理、最新发展及其应用，并简要讨论了封装外壳散热技术的未来发展趋势及面临的挑战。
关键词：芯片冷却；散热器；热管理
中图分类号：TN305.94 文献标识码：A 文章编号：1681-1070（2008）03-0006-05
Heat Disspation Technology and Its Applications in Electronic Packaging
Abstract：As microelectronic device packaging density becomes more complex and compact, its power density and amount of heat disspation increases correspondinngly. Therefore, this paper presents an overview of the principle for heat disspation technology, the new development and application of heat disspation are also discussed. A brief disussion of the future trends and challenges of package heat disspation technology are also described.
Key words: chip cooling; heat sink; thermal management